Integrated circuit package system for stackable devices

Details Integrated circuit package system for stackable devices Integrated circuit package system for stackable devices

2008-02-26

2011-11-29

Lee, Calvin (Department: 2892)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C257S784000

Reexamination Certificate

active

08067307

ABSTRACT:
An integrated circuit package system comprising: providing a package die; and connecting a connector lead having a first connector end with a protruded connection surface and a lowered structure over the package die.

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