Integrated circuit package system

Details Integrated circuit package system Integrated circuit package system

2005-09-22

2008-05-27

Zarneke, David A (Department: 2891)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C257S667000, C257SE23116

Reexamination Certificate

active

07378300

ABSTRACT:
An integrated circuit package system is provided including forming a leadframe structure having a encapsulant space provided predominantly inside the leadframe structure and attaching a die to the leadframe structure in the encapsulant space inside the leadframe structure. The system further includes electrically connecting the die to the leadframe structure and injecting encapsulant into the encapsulant space to form the integrated circuit package system.

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