Integrated circuit package support system

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

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Details

361708, 361719, 257686, 257707, 257723, H05K 712, H05K 720

Patent

active

059562366

ABSTRACT:
A system for supporting integrated circuit packages to prevent mechanical failure of the packages at their connection to a printed circuit board or card involves bracing the packages to the board or card. The packages may also be braced against one another. The structure is particularly well adapted to supporting vertical surface mount packages at a point spaced from the point where they connect to a printed circuit board or card.

REFERENCES:
patent: 5305179 (1994-04-01), Sono et al.
patent: 5566051 (1996-10-01), Burns
patent: 5616962 (1997-04-01), Ishikawa et al.
patent: 5619067 (1997-04-01), Sua et al.
patent: 5664681 (1997-09-01), Derouiche
patent: 5786985 (1998-07-01), Taniguchi et al.

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