Integrated circuit package structure with gap through lead...

Details Integrated circuit package structure with gap through lead... Integrated circuit package structure with gap through lead...

2006-10-02

2008-10-21

Smoot, Stephen W (Department: 2813)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C257S694000, C257S735000, C257S784000, C257SE23033

Reexamination Certificate

active

07439612

ABSTRACT:
In certain embodiments, a leadframe structure for forming one or more integrated circuit packages includes a number of adjacent substantially parallel lead bars adapted to receive a die associated with an integrated circuit at one or more of the lead bars such that the one or more lead bars extend from opposite sides of the die. The leadframe structure also includes one or more support structures (e.g. lead support bars26) adapted to help hold the lead bars together.

REFERENCES:
patent: 5723902 (1998-03-01), Shibata et al.
patent: 6268652 (2001-07-01), Kimura
patent: 6462406 (2002-10-01), Ohgiyama et al.
patent: 6621150 (2003-09-01), Lee et al.
patent: 6800932 (2004-10-01), Lam et al.
patent: 2001/0054750 (2001-12-01), Abbott
patent: 2002/0024121 (2002-02-01), Matumoto
patent: 2005/0098859 (2005-05-01), Hasegawa
patent: 2005/0258520 (2005-11-01), Dolan

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