Integrated circuit package, panel and methods of...

Details Integrated circuit package, panel and methods of... Integrated circuit package, panel and methods of...

2007-07-27

2009-06-30

Zarneke, David A (Department: 2891)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

With attachment to temporary support or carrier

C257SE23179, C438S113000, C438S460000

Reexamination Certificate

active

07553745

ABSTRACT:
A method of manufacturing an integrated circuit package includes: assembling a composite wafer including alternating rows or columns of first and second strips on an adhesive tape, the first strips including a plurality of first dies and the second strips including a plurality of second dies, singulating the first dies from the first strips and the second dies from the second strips, forming a bond wire between respective ones of the first dies and respective ones of the second dies, thereby forming a plurality of component, embedding the components in mold compound, thereby forming a panel and separating the components from the panel, thereby forming individual integrated circuit packages.

REFERENCES:
patent: 6228687 (2001-05-01), Akram et al.
patent: 6960490 (2005-11-01), Cunningham
patent: 2002/0167078 (2002-11-01), Winderl et al.
patent: 2003/0015774 (2003-01-01), Auburger et al.
patent: 2003/0057529 (2003-03-01), Ikenaga
patent: 2003/0062613 (2003-04-01), Masumoto et al.
patent: 2004/0089922 (2004-05-01), Gerber et al.
patent: 2005/0272225 (2005-12-01), Weber et al.
patent: 02/01634 (2002-01-01), None

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