Integrated circuit package-in-package system

Details Integrated circuit package-in-package system Integrated circuit package-in-package system

2007-03-23

2008-09-30

Rose, Kiesha L (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

C257S776000, C257S678000, C257S777000

Reexamination Certificate

active

07429798

ABSTRACT:
A package-in-package system is provided including forming a top substrate having a first integrated circuit electrically connected thereto and mounting a second integrated circuit over the first integrated circuit. The system includes forming first electrical connectors on the second integrated circuit and encapsulating the second integrated circuit in a first encapsulant with the first electrical connectors exposed. The system includes mounting the second integrated circuit over a bottom substrate with the first electrical connectors electrically connected thereto and encapsulating the top substrate and the first encapsulant in a second encapsulant.

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patent: WO/2005008724 (2005-01-01), None

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