Integrated circuit package-in-package system

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Reexamination Certificate

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Details

C257S776000, C257S678000, C257S777000

Reexamination Certificate

active

07429798

ABSTRACT:
A package-in-package system is provided including forming a top substrate having a first integrated circuit electrically connected thereto and mounting a second integrated circuit over the first integrated circuit. The system includes forming first electrical connectors on the second integrated circuit and encapsulating the second integrated circuit in a first encapsulant with the first electrical connectors exposed. The system includes mounting the second integrated circuit over a bottom substrate with the first electrical connectors electrically connected thereto and encapsulating the top substrate and the first encapsulant in a second encapsulant.

REFERENCES:
patent: 6731003 (2004-05-01), Joshi et al.
patent: 6835580 (2004-12-01), Knapp et al.
patent: 6855572 (2005-02-01), Jeung et al.
patent: 6856017 (2005-02-01), Yoneda et al.
patent: 6856025 (2005-02-01), Pogge et al.
patent: 7091592 (2006-08-01), Chen et al.
patent: 7129583 (2006-10-01), Tao et al.
patent: 2004/0113254 (2004-06-01), Karnezos
patent: 2005/0029642 (2005-02-01), Takaya et al.
patent: 2003218085 (2003-09-01), None
patent: 2004327724 (2004-11-01), None
patent: WO/2005008724 (2005-01-01), None

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