Integrated circuit package-in-package system

Details Integrated circuit package-in-package system Integrated circuit package-in-package system

2007-09-18

2007-09-18

Smith, Zandra V. (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

C257S790000, C257S678000, C257S777000

Reexamination Certificate

active

11162637

ABSTRACT:
A package-in-package system is provided including forming a top substrate having a first integrated circuit electrically connected thereto and mounting a second integrated circuit over the first integrated circuit. The system includes forming first electrical connectors on the second integrated circuit and encapsulating the second integrated circuit in a first encapsulant with the first electrical connectors exposed. The system includes mounting the second integrated circuit over a bottom substrate with the first electrical connectors electrically connected thereto and encapsulating the top substrate and the first encapsulant in a second encapsulant.

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patent: 2004327724 (2004-11-01), None
patent: WO/2005008724 (2005-01-01), None

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