Integrated circuit package having a multilayered wiring portion

Details Integrated circuit package having a multilayered wiring portion Integrated circuit package having a multilayered wiring portion

1994-12-30

1995-11-21

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

257723, 257724, 257758, 257777, H01L 2348, H01L 2944

Patent

active

054689970

ABSTRACT:
An integrated circuit package in which three conductor columns for connecting an insulating substrate and an integrated circuit are connected in parallel for use as I/O vias. Thereby, the conductor columns in a multilayer wiring portion between an integrated circuit and an insulating substrate is prevented from disconnecting.

REFERENCES:
patent: 3688018 (1972-08-01), Hiscocks
patent: 4221047 (1980-09-01), Narken et al.
patent: 4649417 (1987-03-01), Burgess et al.
patent: 4811082 (1989-03-01), Jacobs et al.

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