Integrated circuit package formation

Details Integrated circuit package formation Integrated circuit package formation

2008-11-06

2010-06-22

Lebentritt, Michael S (Department: 2829)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S113000, C438S118000, C438S612000, C438S613000, C257SE21499, C257SE21503, C257SE23001, C257SE23067, C257SE23171, C257SE23172, C257SE25011, C257SE25012

Reexamination Certificate

active

07741151

ABSTRACT:
Integrated circuit packages are formed from a panel where the panel is separated by laser cutting the panel. In some embodiments, the panel is attached to the carrier for the formation of interconnect layers on the panel. Afterwards, the panel is cut with a laser while on the carrier to separate the integrated circuit packages. A tape or other type of structure may be attached to the top of the packages after the laser cutting. The integrated circuit packages are removed from the carrier by releasing the adhesive and removing the integrated circuit packages with the tape. The packages are then removed from the tape.

REFERENCES:
patent: 4549200 (1985-10-01), Ecker et al.
patent: 4918811 (1990-04-01), Eichelberger et al.
patent: 5111278 (1992-05-01), Eichelberger
patent: 5144747 (1992-09-01), Eichelberger
patent: 5149662 (1992-09-01), Eichelberger
patent: 5492586 (1996-02-01), Gorczyca
patent: 5561085 (1996-10-01), Gorowitz et al.
patent: 5628919 (1997-05-01), Tomura et al.
patent: 5841193 (1998-11-01), Eichelberger
patent: 6150193 (2000-11-01), Glenn
patent: 6774472 (2004-08-01), Pierson
patent: 6939789 (2005-09-01), Huang et al.
patent: 7015075 (2006-03-01), Fay et al.
patent: 7094633 (2006-08-01), Takiar
patent: 7291874 (2007-11-01), Hsu
patent: 7511365 (2009-03-01), Wu et al.
patent: 7619304 (2009-11-01), Bauer et al.
patent: 2008/0057625 (2008-03-01), Chan et al.
patent: 2009/0261468 (2009-10-01), Kroeninger et al.
patent: 2010/0001396 (2010-01-01), Meyer et al.
patent: 0075983 (2000-12-01), None
R. Iscoff, “On the Cutting Edge: Laser, Water Singulation Bid for Acceptance in a Saw-Dominated Market”, ChipScale Review, Aug. 2003 issue, feature article.
R. Iscoff, “Prime Cuts: What Users Want in Singulation Tools”, ChipScale Review, Aug.-Sep. 2001.

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