Integrated circuit package for burn-in and testing of an integra

Details Integrated circuit package for burn-in and testing of an integra Integrated circuit package for burn-in and testing of an integra

1994-11-15

1996-06-18

Karlsen, Ernest F.

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

324760, G01R 3102

Patent

active

055281575

ABSTRACT:
A method for and a disassemblable prepackage arrangement for testing and burning-in an integrated circuit die which will be hermetically sealed within and form part of an overall integrated circuit package is herein disclosed. The die has a top and bottom surface and includes a plurality of die input/output terminals. The prepackage comprises a substrate including a top surface. The bottom of the die is disengagably attached to the top surface of the substrate. A lid is disengagably attached to the substrate in a way which hermetically seals the die within a space substantially defined by the substrate and the lid. Thereafter, the die input/output terminals are electrically connecting to external testing equipment for testing and burning-in the die while the die is in a hermetically sealed environment.

REFERENCES:
patent: 4801561 (1989-01-01), Sankhagowit
patent: 5155067 (1992-10-01), Wood et al.
patent: 5315239 (1994-05-01), Vitriol
patent: 5336992 (1994-08-01), Saito et al.
patent: 5367253 (1994-11-01), Wood et al.
patent: 5424651 (1995-06-01), Green et al.

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