Integrated circuit package and method of fabrication

Details Integrated circuit package and method of fabrication Integrated circuit package and method of fabrication

1998-03-30

2000-02-22

Chaudhuri, Olik

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

257692, 257693, 257686, 257723, 257726, 257777, 257787, H01L 2348, H01L 2334

Patent

active

060283653

ABSTRACT:
The present invention is directed to a semiconductor package and its method of manufacture. Conductors mounted on a flexible polymer tape are used to connect a semiconductor chip to a substrate. The flexible polymer tape can be folded back under the chip to reduce the size necessary for mounting the assembly to almost that of the chip itself. The polymer tape also provides flexibility to reduce stresses on the electrical connections caused by thermal expansion and compression. Additionally, the present invention allows for the stacking of semiconductor chips on top of one another, reducing signal propagation delays between them.

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