Integrated circuit package and integrated circuit module

Details Integrated circuit package and integrated circuit module Integrated circuit package and integrated circuit module

2011-02-01

2011-02-01

Parekh, Nitin (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S698000, C257S774000, C257S686000, C257SE23141

Reexamination Certificate

active

07880291

ABSTRACT:
An integrated circuit package may include a board that may support an integrated circuit chip. A post pin may be provided on a surface of the board. The post pin may be electrically connected to the integrated circuit chip. A land pin may be provided on the other surface of the board. The land pin may be electrically connected to the integrated circuit chip.

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Korean Office Action with English translation dated Aug. 30, 2006.

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