Integrated circuit package

Details Integrated circuit package Integrated circuit package

2008-10-20

2011-10-11

Estrada, Michelle (Department: 2829)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With window means

C257S666000, C257S687000, C257S787000, C257SE23141, C257SE33066, C257SE23031, C257SE23060

Reexamination Certificate

active

08035208

ABSTRACT:
Package for an integrated circuit (IC), includes a housing (3) of a first material having two major surfaces (4, 5). The major surfaces are substantially parallel to each other. Furthermore, a lead frame (6) is present for carrying the IC (2), the lead frame (6) including contact terminals (7) for electrical communication with the IC (2). The package (1) has a through-hole (8) in the two major surfaces (4, 5), allowing various special applications of the package (1).

REFERENCES:
patent: 6260417 (2001-07-01), Watanabe et al.
patent: 7504666 (2009-03-01), Vittu
patent: 2005/0280017 (2005-12-01), Oshio et al.
patent: 2006/0055500 (2006-03-01), Burke et al.
patent: 2008/0048204 (2008-02-01), Ishikura et al.
patent: 2008/0096321 (2008-04-01), Lin et al.
patent: 2009/0230487 (2009-09-01), Saitoh et al.

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