Integrated circuit package

Details Integrated circuit package Integrated circuit package

2007-10-09

2008-11-25

Cao, Phat X (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

C257S779000, C438S108000

Reexamination Certificate

active

07456503

ABSTRACT:
A semiconductor device, including methods and arrangements for making the same, are described. The device includes an integrated circuit die having a plurality of bond pads. At least one bond pad on the active surface of the die is an extended I/O pad. Each extended I/O pad extends to at least one peripheral side edge of the die. Solder fillets are formed between the extended I/O pads and corresponding contacts on a substrate.

REFERENCES:
patent: 5311405 (1994-05-01), Tribbey et al.
patent: 6034438 (2000-03-01), Petersen
patent: 6060769 (2000-05-01), Wark
patent: 6420208 (2002-07-01), Pozder et al.
patent: 6727116 (2004-04-01), Poo et al.
patent: 6894386 (2005-05-01), Poo et al.
patent: 2005/0194682 (2005-09-01), Ohuchi et al.
patent: 2006/0186551 (2006-08-01), Lange et al.
“Redistributed Process,” http://www.flipchip.com/services/wafer—level/ultra—csp/redistributed—process.shtml, downloaded Dec. 13, 2007.
U.S. Appl. No. 11/774,473, filed Jul. 6, 2007.

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