Integrated circuit memory device and method

Static information storage and retrieval – Floating gate

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C365S185280, C365S185290, C257S135000, C257S316000, C257S328000, C438S201000, C438S206000, C438S211000, C438S212000, C438S257000

Reexamination Certificate

active

07027328

ABSTRACT:
Structures and methods for DEAPROM memory with low tunnel barrier intergate insulators are provided. The DEAPROM memory includes a first source/drain region and a second source/drain region separated by a channel region in a substrate. A floating gate opposes the channel region and is separated therefrom by a gate oxide. A control gate opposes the floating gate. The control gate is separated from the floating gate by a low tunnel barrier intergate insulator having a tunnel barrier of less than 1.5 eV. The low tunnel barrier intergate insulator includes a metal oxide insulator selected from the group consisting of NiO, Al2O3, Ta2O5, TiO2, ZrO2, Nb2O5, Y2O3, Gd2O3, SrBi2Ta2O3, SrTiO3, PbTiO3, and PbZrO3. The floating gate includes a polysilicon floating gate having a metal layer formed thereon in contact with the low tunnel barrier intergate insulator. And, the control gate includes a polysilicon control gate having a metal layer formed thereon in contact with the low tunnel barrier intergate insulator.

REFERENCES:
patent: 4295150 (1981-10-01), Adam
patent: 4412902 (1983-11-01), Michikami et al.
patent: 4688078 (1987-08-01), Hseih
patent: 4757360 (1988-07-01), Faraone
patent: 4780424 (1988-10-01), Holler et al.
patent: 4939559 (1990-07-01), DiMaria et al.
patent: 5042011 (1991-08-01), Casper et al.
patent: 5071782 (1991-12-01), Mori
patent: 5073519 (1991-12-01), Rodder
patent: 5280205 (1994-01-01), Green et al.
patent: 5350738 (1994-09-01), Hase et al.
patent: 5399516 (1995-03-01), Bergendahl et al.
patent: 5418389 (1995-05-01), Watanabe
patent: 5474947 (1995-12-01), Chang et al.
patent: 5488612 (1996-01-01), Heybruck
patent: 5497494 (1996-03-01), Combs et al.
patent: 5498558 (1996-03-01), Kapoor
patent: 5508544 (1996-04-01), Shah
patent: 5600592 (1997-02-01), Atsumi et al.
patent: 5618575 (1997-04-01), Peter
patent: 5618761 (1997-04-01), Eguchi et al.
patent: 5619051 (1997-04-01), Endo
patent: 5627785 (1997-05-01), Gilliam et al.
patent: 5677867 (1997-10-01), Hazani
patent: 5691230 (1997-11-01), Forbes
patent: 5801401 (1998-09-01), Forbes
patent: 5852306 (1998-12-01), Forbes
patent: 5880991 (1999-03-01), Hsu et al.
patent: 5923056 (1999-07-01), Lee et al.
patent: 5936274 (1999-08-01), Forbes et al.
patent: 5959465 (1999-09-01), Beat
patent: 5973355 (1999-10-01), Shirai et al.
patent: 5981350 (1999-11-01), Geusic et al.
patent: 5986932 (1999-11-01), Ratnakumar et al.
patent: 5991225 (1999-11-01), Forbes et al.
patent: 6009011 (1999-12-01), Yamauchi
patent: 6025228 (2000-02-01), Ibok et al.
patent: 6025627 (2000-02-01), Forbes et al.
patent: 6031263 (2000-02-01), Forbes et al.
patent: 6069380 (2000-05-01), Chou et al.
patent: 6069816 (2000-05-01), Nishimura
patent: 6124729 (2000-09-01), Noble et al.
patent: 6134175 (2000-10-01), Forbes et al.
patent: 6135175 (2000-10-01), Gaudreault et al.
patent: 6141238 (2000-10-01), Forbes et al.
patent: 6141248 (2000-10-01), Forbes et al.
patent: 6143636 (2000-11-01), Forbes et al.
patent: 6153468 (2000-11-01), Forbes et al.
patent: 6163049 (2000-12-01), Bui
patent: 6169306 (2001-01-01), Gardner et al.
patent: 6208164 (2001-03-01), Noble et al.
patent: 6210999 (2001-04-01), Gardner et al.
patent: 6229175 (2001-05-01), Uchida
patent: 6238976 (2001-05-01), Noble et al.
patent: 6246606 (2001-06-01), Forbes et al.
patent: 6249020 (2001-06-01), Forbes et al.
patent: 6249460 (2001-06-01), Forbes et al.
patent: 6307775 (2001-10-01), Forbes et al.
patent: 6317364 (2001-11-01), Guterman et al.
patent: 6323844 (2001-11-01), Yeh et al.
patent: 6341084 (2002-01-01), Numata et al.
patent: 6351411 (2002-02-01), Forbes et al.
patent: 6377070 (2002-04-01), Forbes
patent: 6424001 (2002-07-01), Forbes et al.
patent: 6461931 (2002-10-01), Eldridge
patent: 6514842 (2003-02-01), Prall et al.
patent: 6521943 (2003-02-01), Mine et al.
patent: 6541280 (2003-04-01), Kaushik et al.
patent: 6586797 (2003-07-01), Forbes et al.
patent: 6730575 (2004-05-01), Eldridge
patent: 6740928 (2004-05-01), Yoshii et al.
patent: 6754108 (2004-06-01), Forbes
patent: 6778441 (2004-08-01), Forbes et al.
patent: 2001/0013621 (2001-08-01), Nakazato
patent: 2002/0008324 (2002-01-01), Shinkawata
patent: 2002/0106536 (2002-08-01), Lee et al.
patent: 2002/0109138 (2002-08-01), Forbes
patent: 2002/0137250 (2002-09-01), Nguyen et al.
patent: 2003/0043637 (2003-03-01), Forbes et al.
patent: 2003/0207032 (2003-11-01), Ahn et al.
patent: 2003/0207540 (2003-11-01), Ahn et al.
patent: 2005/0023595 (2005-02-01), Forbes et al.
patent: 2005/0023603 (2005-02-01), Eldridge et al.
patent: 2005/0169054 (2005-08-01), Forbes
Aarik, Jaan , et al., “Anomalous effect of temperature on atomic layer deposition of titanium oxide”,Journal of Crystal Growth, (2000),pp. 531-537.
Aarik, Jaan , et al., “Texture development in nanocrystalline hafnium dioxide thin films grown by atomic layer deposition”,Journal of Crystal Growth, 220(1-2), (2000),105-113.
Afanas'ev, V , et al., “Electron energy barriers between (100)Si and ultrathin stacks of SiO2, AI2O3, adn ZrO3 and ZrO2 insulators”,Applied Physics Letters 78(20), (2001),pp. 3073-3075.
Arya, S. , et al., “Conduction Properties of Thin AI2O3 Films”,Thin Solid Films, 91, (1982),363-374.
Dipert, Brian, “Flash Memory Goes Mainstream”,IEEE Spectrum, 30(10), (Oct. 1993),48-52.
Eierdal, L. , et al., “Interaction of oxygen with Ni(110) studied by scanning tunnelign microscopy”,Surface Science, 312, (1994),pp. 31-53.
Eldridge, J. , et al., “Analysis of Ultrathin Oxide Growth on Indium”,Thin Solid Films, 12, (1972),pp. 447-451.
Eldridge, J. , et al., “Measurement of Tunnel Current Density in a Metal-Oxide-Metal System as a Function of Oxide Thickness”,Proc. 12th Intern. Conf. on Low Temperature Physics, (1971),427-428.
Eldridge, J.M. , et al., “The Growth of Thin PbO Layers on Lead Films”,Surface Science vol. 40, (1973),512-530.
Ferguson, J D., et al., “Atomic layer deposition of AI2O3 and SiO2 on BN particles using sequential surface reaction”,Applied Surface Science, (2000),pp. 280-292.
Greiner, J. , “Josphson Tunneling Barriers by rf Sputter Etching in an Oxygen Plasms”,Journal of Applied Physics, 42(12), (Nov. 1971),5151-5155.
Greiner, J. , “Oxidation of lead films by rf sputter etching in an oxygen plasms”,Journal of Applied Physics, 45(1), (1974),32-37.
Grimbolt, J. , “I. Interaction of Al Films with O2 at Low Pressures”,Journal of the Electrochemical Society, 129(10), (1982),pp. 2366-2368.
Grimbolt, J. , “II. Oxidation of AI Films”,Journal of Electrochem Soc.: Solid-State Science and Technology, (1982),pp. 2369-2372.
Gundlach, K. , et al., “Logarithmic Conductivity of AI-AI2O3-AI Tunneling Junctions Produced by Plasma and by Thermal Oxidation”,Surface Science, 27, (1971),125-141.
Guo, X. , “High Quality Ultra-thin (1.5 nm) TiO2/Si3N4 Gate Dielectric for Deep Sub-micron CMOS Technology”,IEDM Technical Digest, (1999), pp. 137-140.
Hodges, D. A.,Analysis and Design of Digital Integrated Circuits, 2nd Edition, McGraw-Hill Publishing. New York,(1988),pp. 354-357, 394-396.
Hurych, Z. , “Influence of Non-Uniform Thickness of Dielectric Layers on Capacitance and Tunnel Currents”,Solid-State Electronics, vol. 9, (1966),967-979.
Itokawa, H , “Determination of Bandgap and Energy Band Aligbnment for High-Dielectric-Constant Gate Insulators Using High-Resolution X-ray Photoelectron Spectroscopy”,Extended Abstracts of the 1999 International Conference on Solid State Devices and Materials, (1999),pp. 158-159.
Kim, Yong S., et al., “Effect of rapid thermal annealing on the structure and the electrical properties of atomic-layer-deposited Ta2O5 films”,Journal of the Korean Physical Society, (Dec. 2000),pp. 975-979.
Kim, H. , “Leakage current and electrical breakdown in metal-organic chemical vapor deposited TiO2 dielectrics on silicon substrates”,Applied Phys. Lett., 69(25), (1996),pp. 3860-3862.
Kim, Yeong K.,

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Integrated circuit memory device and method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Integrated circuit memory device and method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated circuit memory device and method will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3592400

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.