Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent
1998-08-12
1999-11-16
Clark, Sheila V.
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
257676, 257675, H01L 23495
Patent
active
059863323
ABSTRACT:
A lead frame includes a die attach pad having a certain area with a portion of the area being adapted to receive and support an integrated circuit die. The lead frame also includes a plurality of leads for electrically connecting the integrated circuit die to other electrical elements external to the package. At least one of the leads is configured to have a portion of the lead overhang, but be spaced slightly apart from, the area of the die attach pad. The overhanging portions of the leads are positioned in close proximity to the die attach pad in order to improve the thermal transfer from the die attach pad to the leads during the operation of the integrated circuit package. A method of forming the lead frame includes the step of folding at least a portion of the lead frame which includes at least one of the leads such that the at least one lead is positioned with a portion of that lead overhanging, but being spaced slightly apart from, the die attach pad.
REFERENCES:
patent: 5206794 (1993-04-01), Long
patent: 5252855 (1993-10-01), Ogawa et al.
patent: 5675182 (1997-10-01), Moscicki
patent: 5703396 (1997-12-01), Kurihara
patent: 5821628 (1998-10-01), Hotta
Chu Chin Seng
Spalding Peter H.
Clark Sheila V.
National Semiconductor Corporation
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