Integrated-circuit leadframe adapted for a simultaneous bonding

Details Integrated-circuit leadframe adapted for a simultaneous bonding Integrated-circuit leadframe adapted for a simultaneous bonding

1984-03-22

1988-01-26

Curtis, Marshall M.

Boots, shoes, and leggings

29827, 2281802, 357 70, H01R 909, H01L 2300

Patent

active

047220600

ABSTRACT:
A leadframe for an integrated circuit includes a set of individual leads temporarily connected in an array; each lead having an exterior portion shaped in a standard form and an interior portion shaped to form a standard array of contacts and to have the same spring constant for deflections perpendicular to the plane of the leadframe.

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