Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent
1995-02-17
1996-07-09
Limanek, Robert P.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
257691, 257693, 257666, H01L 2304
Patent
active
055347290
ABSTRACT:
The present invention provides a modular electronic component (10) wherein a sequence: of leads (26) of a lead frame (12) differs from a sequence of bonding pads (16) on an integrated circuit (14). When lead frame (12) is placed adjacent integrated circuit (14), first and second power buses (22) and (24) are disposed on a first side (18) of bonding pads (16). First portion (30) of leads (26) and lead finger (28) are disposed on second side (20) of bonding pads (16). Bonding members (42) couple appropriate bonding pads (16) with corresponding leads (26), first and second power buses (22) and (24), and lead finger (28). In this manner, the pin out of modular electronic component (10) may be altered by incorporating appropriate lead fingers (28) without changing the sequence of bonding pads (16).
REFERENCES:
patent: H1267 (1993-12-01), Boyd
patent: 4580193 (1986-04-01), Edwards
patent: 4934820 (1990-06-01), Takahashi et al.
patent: 5229639 (1993-07-01), Hansen et al.
patent: 5229846 (1993-07-01), Kozuka
patent: 5252853 (1993-10-01), Michii
Donaldson Rich
Heiting Leo
Holloway William W.
Limanek Robert P.
Texas Instruments Incorporated
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