Integrated circuit lead frame assembly containing voltage bussin

Details Integrated circuit lead frame assembly containing voltage bussin Integrated circuit lead frame assembly containing voltage bussin

1987-07-15

1989-01-31

James, Andrew J.

357 80, H01L 2348, H01L 2312

Patent

active

048019992

ABSTRACT:
An improved integrated circuit package is disclsoed which comprises a flexible lead frame assembly 2 having an integrated circuit die 60 mounted thereto. Lead frame assembly 2 comprises a first conductive metal layer 10 comprising metal leads 18 and 28 capable of being electrically connected to die 60, a flexible dielectric layer 30 attached to at least a portion of the first conductive metal layer 10, and a second metal conductive layer 40 having a portion attached to the opposite side of dielectric layer 30 and also comprising one or more leads 48, 54, and 56 capable of being electrically attached to the die, at least one of the metal layers 10 or 40 further comprises at least one metal bus pattern 12 or 32 or 42 with metal leads 18, 28, and 48 capable of being electrically attached to die 60. In a preferred embodiment, each of the two conductive metal layers 10 and 40 comprises at least one metal bus 12, 22, or 42 with leads 18, 28, and 48 for interconnecting the respective metal bus with pads 64 on integrated circuit die 60.

REFERENCES:
patent: 3838984 (1974-10-01), Crane et al.
patent: 4288841 (1981-09-01), Gogal
patent: 4410905 (1983-10-01), Grabbe
patent: 4417266 (1983-11-01), Grabbe
patent: 4496965 (1985-01-01), Orcutt et al.
patent: 4587548 (1986-05-01), Grabbe et al.
patent: 4680613 (1987-07-01), Daniels et al.
patent: 4725878 (1988-02-01), Miyauchi et al.
patent: 4734818 (1988-03-01), Hernandez et al.

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