Inductor devices – Interlinked coils or windings
Reexamination Certificate
2002-03-18
2004-11-30
Nguyen, Viet Q. (Department: 2818)
Inductor devices
Interlinked coils or windings
C336S186000, C336S08400R, C336S098000, C336S147000, C029S604000
Reexamination Certificate
active
06825747
ABSTRACT:
FIELD OF THE INVENTION
This invention relates to inductors, and more particularly, it relates to inductors used with integrated circuits.
BACKGROUND OF THE INVENTION
Inductors are used in a wide range of signal processing systems and circuits. For example, inductors are used in communication systems, radar systems, television systems, highpass filters, tank circuits, and butterworth filters.
As electronic signal processing systems have become more highly integrated and miniaturized, effectively signal processing systems on a chip, system engineers have sought to eliminate the use of large, auxiliary components, such as inductors. When unable to eliminate inductors in their designs, engineers have sought ways to reduce the size of the inductors that they do use.
Simulating inductors using active circuits, which are easily miniaturized, is one approach to eliminating the use of actual inductors in signal processing systems. Unfortunately, simulated inductor circuits tend to exhibit high parasitic effects, and often generate more noise than circuits constructed using actual inductors.
Inductors are miniaturized for use in compact communication systems, such as cell phones and modems, by fabricating spiral inductors on the same substrate as the integrated circuit to which they are coupled using integrated circuit manufacturing techniques. Unfortunately, spiral inductors take up a disproportionately large share of the available surface area on an integrated circuit substrate.
For these and other reasons there is a need for the present invention.
SUMMARY OF THE INVENTION
The above mentioned problems and other problems are addressed by the present invention and will be understood by one skilled in the art upon reading and studying the following specification. An integrated circuit inductor compatible with integrated circuit manufacturing techniques is disclosed.
In one embodiment, an inductor capable of being fabricated from a plurality of conductive segments and interwoven with a substrate is disclosed. In an alternate embodiment, a sense coil capable of measuring the magnetic field or flux produced by an inductor comprised of a plurality of conductive segments and fabricated on the same substrate as the inductor is disclosed.
REFERENCES:
patent: 3553533 (1971-01-01), Haberecht
patent: 3561110 (1971-02-01), Feulner et al.
patent: 3614554 (1971-10-01), Richardson et al.
patent: 3691497 (1972-09-01), Bailey et al.
patent: 3731005 (1973-05-01), Shearman
patent: 3881244 (1975-05-01), Kendall
patent: 3988764 (1976-10-01), Cline et al.
patent: 3996095 (1976-12-01), Ahn et al.
patent: 4024565 (1977-05-01), Anthony et al.
patent: 4729510 (1988-03-01), Landis
patent: 4839659 (1989-06-01), Stern et al.
patent: 4845452 (1989-07-01), Sasaki et al.
patent: 5095357 (1992-03-01), Andoh et al.
patent: 5177670 (1993-01-01), Shinohara et al.
patent: 5227659 (1993-07-01), Hubbard
patent: 5336921 (1994-08-01), Sundaram et al.
patent: 5448822 (1995-09-01), Wu et al.
patent: 5450755 (1995-09-01), Saito et al.
patent: 5479695 (1996-01-01), Grader et al.
patent: 5670415 (1997-09-01), Rust
patent: 5696471 (1997-12-01), Fujiwara
patent: 5767563 (1998-06-01), Imam et al.
patent: 5801521 (1998-09-01), Mizoguchi et al.
patent: 5875452 (1999-02-01), Katayama et al.
patent: 5956073 (1999-09-01), Jin et al.
patent: 6013939 (2000-01-01), El-Sharawy et al.
patent: 6031273 (2000-02-01), Torok et al.
patent: 6054750 (2000-04-01), Imam et al.
patent: 6069397 (2000-05-01), Cornett et al.
patent: 6240622 (2001-06-01), Ahn et al.
patent: 6249039 (2001-06-01), Harvey et al.
patent: 6291872 (2001-09-01), Wang et al.
patent: 6303971 (2001-10-01), Rhee
patent: 6446327 (2002-09-01), Ahn et al.
patent: 6459135 (2002-10-01), Basteres et al.
patent: 6531945 (2003-03-01), Ahn et al.
patent: 6542060 (2003-04-01), Fedeli
patent: 6548365 (2003-04-01), Basteres et al.
patent: 6573822 (2003-06-01), Ma et al.
patent: 6696912 (2004-02-01), Ahn et al.
patent: 403286512 (1991-12-01), None
patent: 406089976 (1994-03-01), None
patent: 06-120036 (1994-04-01), None
patent: 411251143 (1999-09-01), None
patent: 2000-269059 (2000-09-01), None
Kaito, C..,et al. , “Structure of iron oxide films prepared by evaporating various iron oxide powders”,Applications of Surface Science, 22/23, North -Holland, Amsterdam, (1985),pp. 621-630.
Dimitrov, D.. V. , et al. , “Stoichiometry and Magnetic Properties of Iron Oxide Films”,Materials Research Society Symposium Proceedings, 494, (1998),pp. 89-94.
Fujii, E., et al. , “Low-temperature preparation and properties of spinel-type iron oxide films by ECR plasma-enhanced metalorganic chemical vapor deposition”,Japanese Journal of Applied Physics, 32(10B), (Oct. 1993),pp. 1527-1529.
Ouchi, H.., et al. , “High rate deposition of iron-oxide thin films by reactive sputtering”,IEEE Transactions on Magnetics, vol. MAG-19, No. 5, (Sep. 1983),pp. 1980-1982.
Soh, H. . T.,et al., “Ultra-Low Resistance, Through-Wafer Via (TWV) Technology and its Applications in Three Dimensional Structures on Silicon”,Japanese Journal of Applied Physics, 38(4B), (April 1999),pp. 284-285.
Park, J.. Y. ,et al. , “Ferrite-Based Intergrated Planar Inductor and Transformers Fabricated at Low Temperature”,IEEE Transactions on Magnetics, 33 (5), (Sep. 1997),pp. 3322-3324.
Park, J.. Y., et al. , “Fully Integrated Micromachined Inductors with Electroplated Anisotropic Magnetic Cores”,Thirteenth Annual Applied Power Electronics Conference and Exposition, vol. 1, Conference Proceedings, Anaheim, California,(1998),379-385.
Macchesney, J.. B.,et al. , “Chemical vapor deposition of iron oxide films for use as semitransparent masks”,Journal of the Electrochemical Society, 118 (5), (May 1971),pp. 776-781.
Li, J..L. ,et al. ,“Preparation of amorphous iron-containing and crystalline iron oxide films by glow discharge and their properties”,Material Science&Engineering, B7, (Sep. 1990), pp. 5-13.
Lin, J..K. ,et al. ,“Properties of RF Sputtered Iron Oxide Thin Films With CoCr and Nb as Dopants”,IEEE Transactions on Magnetics, 21(5), (Sep. 1985),pp. 1462-1464.
Domke, M..,et al. ,“Magnetic and electronic properties of thin iron oxide films”,Surface Science, 126, (Mar. 1983),pp. 727-732.
Ouyang, M..,et al. ,“Structure and Magnetic Properties of Iron Oxide Films Deposited by Excimer Laser Ablation of a Metal-Containing Polymer”,Material Research Bulletin, 32(8), (1997),pp. 1099-1107.
Dhara, S., et al. ,“Direct Deposit of highly coercive gamma iron oxide thin films for magnetic recording”,Journal of Applied Physics, 74(11), (Dec. 1993),pp. 7019-7021.
Joshi, S..,et al. ,“Pulsed laser deposition of iron oxide and ferrite flms”,Journal of Applied Physics, 64 (10), Abstract—Fourth Joint Magnetism and Magnetic Materials—Intermag Conference Vancouver, BC,(Nov. 1988),pp. 5647-5649.
Shigematsu, T..,et al. ,“Magnetic properties of amorphous iron (III) oxide thin films”,Journal de Physique Colloque, International Conference on the Applications of the Mossbauer Effect, Kyoto, Japan,(Mar. 1979), pp. 153-154.
Itoh, T..,et al. ,“Ferrite plating of Ba-containing iron oxide films using chelated highly alkaline (pH equals 11-13) aqueous solutions”,Japanese Journal of Applied Physics, 34(3), (Mar. 1995),pp. 1534-1536.
Zheng, Y..,et al. ,“Structure and magnetic properties of sputtered iron oxide films”,Proceedings of the International Symposium on Physics of Magnetic Materials, (1987),pp. 146-149.
Kim, Y J .., et al. ,“Surface Micromachined Solenoid Inductors for High Frequency Applications”,1997 International Symposium on Microelectronics, (1997), 1-6.
Ahn, Chong H., et al., “A fully integrated planar toroidal inductor with a micromachined nickel-iron magnetic bar”,IEEE Transaction on Components, Packaging, and Manufacturing Technology, Part A—vol. 17, No. 3, (Sep. 1994),463-469.
Ahn Kie Y.
Forbes Leonard
Micro)n Technology, Inc.
Nguyen Viet Q.
Schwegman Lundberg Woessner & Kluth P.A.
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