Integrated circuit heat transfer element and method

Details Integrated circuit heat transfer element and method Integrated circuit heat transfer element and method

1996-03-21

1998-11-10

Picardat, Kevin

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

438125, H01L 2144

Patent

active

058343377

ABSTRACT:
An integrated circuit heat transfer element (6,30) is made by selecting thermally conductive fibers having aspect ratios of length to diameter of more than 1, selecting a resin and combining the fibers and the resin to create a formable resin/fiber compound. The resin/fiber compound is formed into a composite material in part by applying pressure to the formable resin/fiber compound, which aligns the fibers, and when cured creates a thermally anisotropic composite material to maximize heat conduction along the aligned fibers. The thermally anisotropic composite material has a coefficient of thermal expansion (CTE) of less than about 10.times.10.sup.-6 cm/cm/.degree. C. The composite material has a thermal conductivity in the direction of the carbon fibers of at least 50 W/m.degree. K. The IC device is preferably secured to the heat transfer element using a thermally conductive adhesive.

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