4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Metallic housing or support

Scott M. Unger

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Integrated circuit heat transfer element and method

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Patent

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Integrated circuit subassembly with thermally anisotropic heat t

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Portion of housing of specific materials
Patent

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Profile ID: LFUS-PAI-P-1514961

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