Integrated circuit having a plurality of MOSFET devices

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material

Reexamination Certificate

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C438S279000, C257SE21598

Reexamination Certificate

active

07932178

ABSTRACT:
A method is provided for manufacturing an integrated circuit having a plurality of MOSFET devices, comprising the steps of: providing a plurality of MOSFET devices each having a first and a second structural parameter associated therewith, wherein a value of one of the first and a second structural parameter of each device is selected to provide a value of a performance parameter of the device substantially equal to a predetermined reference value, the predetermined reference value being the same for each device.

REFERENCES:
patent: 6204542 (2001-03-01), Kinoshita et al.
patent: 2005/0032275 (2005-02-01), Toda et al.
patent: 2005/0098829 (2005-05-01), Doris et al.
patent: 2005/0233540 (2005-10-01), Yoon et al.
patent: 2006/0131662 (2006-06-01), Yamada et al.

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