Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2011-04-26
2011-04-26
Le, Thao X (Department: 2892)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S279000, C257SE21598
Reexamination Certificate
active
07932178
ABSTRACT:
A method is provided for manufacturing an integrated circuit having a plurality of MOSFET devices, comprising the steps of: providing a plurality of MOSFET devices each having a first and a second structural parameter associated therewith, wherein a value of one of the first and a second structural parameter of each device is selected to provide a value of a performance parameter of the device substantially equal to a predetermined reference value, the predetermined reference value being the same for each device.
REFERENCES:
patent: 6204542 (2001-03-01), Kinoshita et al.
patent: 2005/0032275 (2005-02-01), Toda et al.
patent: 2005/0098829 (2005-05-01), Doris et al.
patent: 2005/0233540 (2005-10-01), Yoon et al.
patent: 2006/0131662 (2006-06-01), Yamada et al.
Chee Jeffrey
Lai Chung Woh
Lee Yong Meng
Lun Zhao
Mishra Shailendra
Globalfoundries Singapore Pte. Ltd.
Huber Robert
Le Thao X
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