Electronic digital logic circuitry – Clocking or synchronizing of logic stages or gates – Field-effect transistor
Reexamination Certificate
1999-09-21
2001-08-14
Tokar, Michael (Department: 2819)
Electronic digital logic circuitry
Clocking or synchronizing of logic stages or gates
Field-effect transistor
C326S093000, C326S095000, C326S098000, C326S062000, C326S068000, C326S080000, C327S333000
Reexamination Certificate
active
06275070
ABSTRACT:
FIELD OF THE INVENTION
The present invention relates in general to integrated circuits, and more particularly to an integrated circuit memory having a high speed clock input buffer.
BACKGROUND OF THE INVENTION
Integrated circuit static random access memories (SRAMs) are used in a variety of applications today. In particular, high speed synchronous SRAMs are used in such applications as caches for computer systems, work stations, and the like. These cache memories provide a high speed storage of data or instructions that are likely to be reused. As integrated circuit technology has improved, microprocessors have correspondingly increased in speed and as microprocessor speed increases the access time of the SRAMs must decrease to provide efficient cache storage.
Integrated circuits (ICs) that are used in modern electrical systems must be designed to effectively and efficiently communicate between different types of devices that are powered by different voltage supplies. For example, it is not unusual for a 3.3 volt microcontroller unit (MCU), to be coupled to a 1.8 volt memory device. In order for these devices to effectively communicate with each other in an electrical design, the input and output buffers of the ICs must be able to accommodate different voltages.
As CMOS (complementary metal-oxide semiconductor) technologies migrate to higher performance, small device sizes, and lower power supply voltages, for example, 1.8 volts, the CMOS transistors cannot tolerate higher voltages, for example, more than 2.5 volts. In a high performance synchronous memory, all inputs have to endure high voltage stress and step down, or level shift, the higher voltage input signal (e.g. 3.3 volts) to the lower internal voltages (e.g. 1.8 volts). To handle the stress of higher input voltages, thicker oxide transistors are required. However, the switching speed of these thicker oxide transistors is generally slower. Also, the thicker oxide transistors have longer channel lengths and higher threshold voltages which tends to reduce their switching speed. In addition, the level shifting operation also tends the slow the speed of the input buffer.
The above issues can be illustrated with respect to FIG. 
1
. 
FIG. 1
 illustrates a conventional input buffer circuit 
10
 that is currently used in the IC industry for buffering input clock signals for a synchronous memory. Circuit 
10
 is provided with a clock input signal (CLOCK) and a control signal (SLEEP), and provides differential clock signals CLK and CLKB as shown in FIG. 
1
. Circuit 
10
 includes an inverter 
12
, N-channel transistor 
16
, P-channel transistor 
14
, latch 
18
, and inverter 
20
. Inverter 
12
 includes N-channel transistor 
15
 and P-channel transistor 
13
. The CLOCK signal is provided as an input to the gates of transistors 
13
 and 
15
. The SLEEPB control signal is active as a logic low and causes N-channel transistor 
16
 to be off, thus preventing current flow through transistors 
13
 and 
15
 when the SLEEPH control signal is active. Also, when SLEEPB is active, P-channel transistor 
14
 is on causing the output terminal of inverter 
12
 to be a logic high irregardless of the logic state of signal CLOCK.
Latch 
18
 has an input coupled to the output of inverter 
12
, and an output coupled to the input of inverter 
20
. Inverter 
20
 provides a buffered clock signal CLK, and the output of inverter 
12
 provides a logical complement of signal CLK labeled “CLKB”. Circuit 
10
 is supplied with a power supply voltage labeled “V
DD
”. The level shifting of clock signal CLOCK is done by transistors 
13
, 
15
, and 
16
. Latch 
18
 is required to provide hysteresis.
Circuit 
10
 is designed to interface with an external circuit that operates at the same power supply voltage V
DD
. The external circuit provides clock signal CLOCK to circuit 
10
 as a “rail-to-rail” signal at about V
DD
. The transistors of circuit 
10
 all contain equal gate oxide thickness layers. The trip point of inverter 
12
 is determined by the relative sizes of transistors 
13
 and 
15
. If circuit 
10
 was used to interface with an external circuit that provided the clock signal at a higher voltage than V
DD
, transistors 
13
 and 
15
 may need to be fabricated with a thicker gate oxide to handle the higher voltage clock signal. However, converting transistors 
13
 and 
15
 to have relatively thicker gate oxide layers does not result in a high speed clock input buffer. To satisfy the trip point requirement, transistor 
13
 would have to be made excessively large or the size of transistor 
15
 would have to be made excessively small, which would further degrade performance.
FIG. 2
 illustrates another conventional input buffer circuit 
30
 that is currently used in the IC industry. Input buffer circuit 
30
 includes series-connected inverters 
32
 and 
34
 and is for buffering input signals from an IC operating at a first power supply voltage (e.g. 3.3 volts) V
DDX 
and another IC operating at a second lower power supply voltage V
DD 
(e.g. 1.8 volts). Each of the transistors of input buffer circuit 
30
 have relatively thicker gate oxide layers to handle the stress from the higher power supply voltage V
DDX 
and the input signal CLOCK. Inverter 
34
 provides a level shifting function.
Input buffer circuits 
10
 and 
30
 both suffer from some of the same disadvantages. The thicker oxide transistors have a slower switching speed than their thin oxide counterparts. Also, the level shifter increases propagation delay. Because in synchronous integrated circuits, such as a synchronous memory, the clock marks the beginning of a cycle, the faster the clock is, the faster the memory can operate. The above conventional input buffer circuits 
10
 and 
30
 are generally inadequate for high speed operation when a level shifting function is required.
Therefore, a need exists in the industry to improve the performance and response time of clock input buffers for synchronous integrated circuits, such as synchronous memories, while simultaneously ensuring that voltage compatibility is still adequate. Such an integrated circuit is provided by the present invention, whose features and advantages will be better understood with the attached drawings in conjunction with the following detailed description.
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patent: 6054875 (2000-04-01), Wayner
patent: 6094083 (2000-07-01), Noda
patent: 6097214 (2000-08-01), Troussel et al.
Lau Wai Tong
Pantelakis Dimitris C.
Hill Daniel D..
Motorola Inc.
Tan Vibol
Tokar Michael
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