Integrated circuit die and an electronic assembly having a...

Details Integrated circuit die and an electronic assembly having a... Integrated circuit die and an electronic assembly having a...

2006-09-26

2006-09-26

Kebede, Brook (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Chip mounted on chip

C257S778000, C257SE21503, C257SE21511, C438S108000

Reexamination Certificate

active

07112887

ABSTRACT:
An electronic assembly is assembled by stacking two or more integrated circuit dies on top of one another. Prior to singulation, an opening is laser-drilled into an upper die, and subsequently filled with a conductive member. The conductive member is located on a lower die and interconnects integrated circuits of the upper and lower dies. Laser-drilling allows for faster throughput when compared to, for example, etching, especially if a small number of openings has to be formed. The opening is laser-drilled from an upper surface of the upper die all the way through the die, which allows for the use of alignment marks on an upper surface of the upper die.

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