Integrated circuit devices with an auxiliary pad for contact...

Details Integrated circuit devices with an auxiliary pad for contact... Integrated circuit devices with an auxiliary pad for contact...

2007-01-16

2007-01-16

Smoot, Stephen W. (Department: 2813)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

C257S773000, C257S786000

Reexamination Certificate

active

10770738

ABSTRACT:
An integrated circuit device structure which avoids misalignment when a contact hole is formed to expose a contact pad and a method of fabricating the same, are provided. The integrated circuit device includes a semiconductor substrate having a conductive region and an insulating region, a contact pad on the conductive region of the semiconductor substrate, an auxiliary pad adjacent to the contact pad, and an interlevel insulating layer on the semiconductor substrate and having a contact hole for exposing both the contact pad and the auxiliary pad.

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