Integrated circuit device having strip line structure therein

Details Integrated circuit device having strip line structure therein Integrated circuit device having strip line structure therein

1988-07-22

1989-10-17

Hille, Rolf

357 74, 357 80, H01L 2312, H01L 2314

Patent

active

048750875

ABSTRACT:
An integrated circuit device including: at least one semiconductor chip (3) having a plurality of circuit elements; a package (21 to 24) enclosing the semiconductor chip with a hermetic seal; and a strip line unit (15-2, 11-1b, 11-2, 20 and 23:15-1, 11-1, 11-2, 11-3, 12-1 and 20) for connecting the circuit elements in the semiconductor chip to circuit outside of the package. The stripline unit having a microstrip line structure and a triplate strip line structure serial-connected to the microstrip line structure and connecting the outside circuits. The triplate strip line structure has a characteristic impedance equal to that of the microstrip line structure so that the strip line unit satisfies the required impedance matching.
A center of the conductive layer strip line of the triplate strip line structure has a smaller width than that of a microstrip line of the microstrip line structure to have a predetermined impedance so that the triplate strip line structure has a same characteristic impedance as that of the microstrip line structure.

REFERENCES:
patent: 4047132 (1977-09-01), Krajewski
patent: 4259684 (1981-03-01), Dean et al.
patent: 4276558 (1981-06-01), Ho et al.
patent: 4498122 (1985-02-01), Rainal
IEEE Proceedings, vol. 128, part H, No. 1, Feb. 1981, pp. 26-33; Hall et al., "Design of Microstrip Antenna Feeds. Part 2: Design and Performance Limitations of Triplate Corporate Feeds".
Patent Abstracts of Japan, vol. 8, No. 285 (E-287)[1722], Dec. 26, 1984; and JP-A-59 152 649 (Nippon Denki K.K.) Aug. 31, 1984.
European Search Report, The Hague, 05-19-88.

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