Integrated circuit device having improved post for surface-mount

Details Integrated circuit device having improved post for surface-mount Integrated circuit device having improved post for surface-mount

1993-01-21

1996-09-10

Sparks, Donald A.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174 521, 174 522, 174 524, 257692, 257693, 257696, 257723, 257730, 257787, 257797, 437209, 437219, 439 64, 439 68, 439525, 439526, 26427211, 26427215, H05K 702, H01L 2328, H01L 23544

Patent

active

055554881

ABSTRACT:
An electronic device (10) includes a package (16) having two posts (30) suitable for insertion in PCB holes. Package (16) presents a lengthwise molding plane (32) along which the upper portion (42) and bottom portion (44) of package (16) are mated during the molding process. Posts (30) are disposed substantially exclusively in bottom portion (44) so that posts (30) are asymmetric about lengthwise molding plane (32). Thus, even if a top mold (42a) and a bottom mold (44a) are misaligned there will be no effect on the dimensional tolerance of posts (30) and thus the tolerance of post (30) can be closely matched with a PCB hole (20) tolerance to insure a snug fit. Thus, device (10) is mounted edgewise on a PCB (18) by insertion of posts (30) into PCB holes (20) so that tips (24) of lead fingers (4 14) can be connected to PCB (18) by surfacing-mounting techniques or the like.

REFERENCES:
patent: 3987344 (1976-10-01), Ambruoso, Sr. et al.
patent: 4138711 (1979-02-01), Bremenour et al.
patent: 4617585 (1986-10-01), Yasui
patent: 4967262 (1990-10-01), Farnworth
patent: 4975763 (1990-12-01), Baudouin et al.
patent: 5204287 (1993-04-01), McLellan et al.
patent: 5239198 (1993-08-01), Lin et al.
patent: 5308256 (1994-05-01), Tonooko et al.
patent: 5349235 (1994-09-01), Lee et al.

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