Integrated circuit device having bumped power supply buses over

Details Integrated circuit device having bumped power supply buses over Integrated circuit device having bumped power supply buses over

1991-04-16

1992-01-21

LaRoche, Eugene R.

357 68, H01L 2348

Patent

active

050831879

ABSTRACT:
An integrated circuit device is disclosed. In one embodiment, the device has a semiconductor chip having an electrical circuit that is connected to a bonding pad. A metal layer overlies the bonding pad, and a metal bump is connected to the metal layer. The metal bump receives power for the electrical circuit. The method of manufacture allows a designer to form a power supply bus in the metal layer. The metal layer may lie over an active circuit of the semiconductor chip.

REFERENCES:
patent: 4742023 (1988-05-01), Hasagawa
patent: 4835593 (1989-05-01), Arnold et al.
W. Schroen, "Chip Packages Enter the 21st Century", Machine Design, Feb. 11, 1988, pp. 137-143.
G. Heinen, et al., "Multichip Assembly with Flipped Integrated Circuits", IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. 12, No. 4, Dec. 1989, pp. 650-657.

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