Integrated circuit device and method to prevent cracking during

Details Integrated circuit device and method to prevent cracking during Integrated circuit device and method to prevent cracking during

1991-07-15

1992-11-17

LaRoche, Eugene R.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257787, 257618, H01L 2348

Patent

active

051648156

ABSTRACT:
A semiconductor package device is disclosed. In one embodiment, attached by its active face to a lead-on-chip leadframe having leadfingers is an integrated circuit. The integrated circuit has a roughened backside. An encapsulating material surrounds the integrated circuit and the lead-on-chip leadframe so that the leadfingers are exposed. The roughened backside surface helps to reduce package cracking arising from mounting the device to a printed circuit board by reflow solder.

REFERENCES:
patent: 4003073 (1977-01-01), Helda et al.
patent: 4916519 (1990-04-01), Ward
I. Fukuzawa, et al., "Moisture Resistance Degradation of Plastic LSIs by Reflow Soldering", 1985 IEEE/IRPS, pp. 192-197.

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