Integrated circuit device and manufacturing method using photore

Details Integrated circuit device and manufacturing method using photore Integrated circuit device and manufacturing method using photore

1994-10-11

1995-10-10

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257668, 257667, H01L 2348, H01L 2946, H01L 2954, H01L 2962

Patent

active

054573416

ABSTRACT:
A method of making an integrated circuit (IC) device comprises the steps of providing (300) at least one lead frame (10) comprising a plurality of leads (14), laminating (302) the lead frame (10) with a photoresist, exposing (304) a portion of the photoresist to impose a pattern on the photoresist (10), and developing (306) the photoresist on lead frame (10), such that the photoresist produces a pair of strips and forms non-electrically conductive bonds (30, 32) between leads (14). Further, an IC device comprises a plurality of leads (14) extending from a lead frame (10). The leads (14) comprise an inner lead portion (26), a middle lead portion (27) and an outer lead portion (28). A photoresist is overlaid onto the leads (14). The photoresist comprises an inner strip (30) disposed across the plurality of leads (14) between the inner lead portion (26) and the middle lead portion (27) and an outer strip (32 ) disposed across the plurality of leads (14) between the outer lead portion (28) and the middle lead portion (27). The photoresist inhibits cavity molding (42) plastic from seeping onto inner lead portion (26) or outer lead portion (28) and creates a non-electrically conductive bond between the leads (14).

REFERENCES:
patent: 4899207 (1990-02-01), Hallowell et al.
patent: 5177591 (1993-01-01), Emanuel
patent: 5294827 (1994-03-01), McShane

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