Integrated circuit device

Details Integrated circuit device Integrated circuit device

1986-12-15

1989-02-28

James, Andrew J.

357 74, 357 80, 357 81, H01L 2302, H01L 3902, H01L 2504

Patent

active

048090581

ABSTRACT:
An integrated circuit device comprising a wiring substrate on one surface of which integrated circuit chips are mounted, a power source substrate of a laminated structure provided in contact with the other surface of the wiring substrate and formed by alternately laminating a plurality of feeding conductor layers of a heat conductive metal and a plurality of electrically insulating layers of an electrically insulating material, and bonding together the laminated layers, a means for electrically connecting the wiring substrate and the power source substrate to each other, and a heat radiating means inserted in at least either the feeding conductor layers or the electrically insulating layers and adapted to radiate the heat, which occurs in the power source substrate, to the outside thereof. This integrated circuit device has a power source substrate of a remarkably high heat radiating efficiency, and is suitably used as an integrated circuit device having integrated circuit chips mounted with a high density on a wiring substrate therein.

REFERENCES:
patent: 2501331 (1950-03-01), Heir
patent: 3512582 (1968-07-01), Chu et al.
patent: 4631636 (1986-12-01), Andrews

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