Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate
2007-11-27
2007-11-27
Zarneke, David A. (Department: 2891)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
C438S106000, C257SE21499
Reexamination Certificate
active
10930252
ABSTRACT:
A method and device for cooling an integrated circuit is provided. A method and device using a gas to cool circuit structures such as a number of air bridge structures is provided. A method and device using a boiling liquid to cool circuit structures is provided. Further provided is a method of controlling chip temperature. This allows circuit and device designers an opportunity to design more efficient structures. Some properties that exhibit less variation when temperature ranges are controlled include electromigration, conductivity, operating speed, and reliability.
REFERENCES:
patent: 1254987 (1918-01-01), Cooper
patent: 1976375 (1934-10-01), Smith
patent: 2244608 (1941-06-01), Cooper
patent: 3147110 (1964-09-01), Foerster
patent: 3337334 (1967-08-01), Fenn et al.
patent: 3506438 (1970-04-01), Krock et al.
patent: 3548915 (1970-12-01), Richmond et al.
patent: 3548948 (1970-12-01), Richmond et al.
patent: 3687737 (1972-08-01), Krock et al.
patent: 4389429 (1983-06-01), Soclof
patent: 4561173 (1985-12-01), Te Velde
patent: 4577212 (1986-03-01), Hueckel et al.
patent: 4673589 (1987-06-01), Standley
patent: 4705659 (1987-11-01), Bernstein et al.
patent: 4734820 (1988-03-01), Lauffer et al.
patent: 4770897 (1988-09-01), Wu
patent: 4912548 (1990-03-01), Shanker et al.
patent: 4962058 (1990-10-01), Cronin et al.
patent: 4980754 (1990-12-01), Kotani et al.
patent: 5084750 (1992-01-01), Adlerstein
patent: 5191404 (1993-03-01), Wu et al.
patent: 5303555 (1994-04-01), Chrysler et al.
patent: 5311465 (1994-05-01), Mori et al.
patent: 5324683 (1994-06-01), Fitch et al.
patent: 5324684 (1994-06-01), Kermani et al.
patent: 5336914 (1994-08-01), Andoh
patent: 5408742 (1995-04-01), Zaidel et al.
patent: 5444105 (1995-08-01), Ornstein
patent: 5457334 (1995-10-01), Nishimoto
patent: 5510645 (1996-04-01), Fitch et al.
patent: 5578146 (1996-11-01), Grant et al.
patent: 5593926 (1997-01-01), Fujihira
patent: 5673561 (1997-10-01), Moss
patent: 5701666 (1997-12-01), DeHaven et al.
patent: 5725689 (1998-03-01), Nishida et al.
patent: 5780928 (1998-07-01), Rostoker et al.
patent: 5784328 (1998-07-01), Irrinki et al.
patent: 5891797 (1999-04-01), Farrar
patent: 5994777 (1999-11-01), Farrar
patent: 6392306 (2002-05-01), Khandros et al.
patent: 6413827 (2002-07-01), Farrar
patent: 6433413 (2002-08-01), Farrar
patent: 6574968 (2003-06-01), Symko et al.
patent: 6614092 (2003-09-01), Eldridge et al.
patent: 6670714 (2003-12-01), Miyamoto et al.
patent: 6670719 (2003-12-01), Eldridge et al.
patent: 6674167 (2004-01-01), Ahn et al.
patent: 6679315 (2004-01-01), Cosley et al.
patent: 6686654 (2004-02-01), Farrar et al.
patent: 6709968 (2004-03-01), Eldridge et al.
patent: 6725670 (2004-04-01), Smith et al.
patent: 6744136 (2004-06-01), Dubhashi
patent: 6747347 (2004-06-01), Farrar et al.
patent: 6808015 (2004-10-01), Osakabe
patent: 6861287 (2005-03-01), Farrar et al.
patent: 6992888 (2006-01-01), Iyer
patent: 6994151 (2006-02-01), Zhou et al.
patent: 7035104 (2006-04-01), Meyer
patent: 7095111 (2006-08-01), Hu et al.
patent: 7112542 (2006-09-01), Juengling et al.
patent: 7202562 (2007-04-01), Farrar
patent: 7215547 (2007-05-01), Chang et al.
patent: 2004/0000150 (2004-01-01), Symko et al.
patent: 2005/0285220 (2005-12-01), Farrar
patent: 2006/0238187 (2006-10-01), Farrar
patent: 2006/0244112 (2006-11-01), Farrar
patent: 2006/0249837 (2006-11-01), Farrar et al.
patent: 2007/0023894 (2007-02-01), Farrar
patent: 2007/0042595 (2007-02-01), Farrar
Bhusari, Dhananjay , “Fabrication of Air-Channel Structures for Microfluidic, Microelecromechanical, and Microelectonic Applications”,Journal of Microelectromechanical Systems, 10 (3), (Sep. 2001),400-408.
“‘Green’ Chiller Technology Rolled Out For Earth Day”,Penn State News Release, http://www.sciencedaily.com/releases/2004/04/040421232304.htm,(Apr. 22, 2004).
“Fundamentals of Sonic Cleaning”, http://www.icknowledge.com/misc—technology/Megasonic.pdf, (Archived Apr. 20, 2003),1 page.
“Megasonics—Sage Solvent Alternatives Guide”, http://clean.rti.org/alt.cfm?id=me&cat=ov, Research Triangle Institute,(Mar. 15, 1995).
“What is megasonics cleaning?”, http://www.prosysmeg.com/technology/articles/megasonics—cleaning.php, ProSys, Inc.,(Copyright 1997-2004).
Ballister, Stephen C., et al., “Shipboard Electronics Thermoacoustic Cooler”,Report No. A415003, Naval Postgraduate School, Monterey, CA, Abstract,(Jun. 1995).
Blodgett, A J., et al., “Thermal Conduction Module: A High-Performance Multilayer Ceramic Package”,IBM Journal of Research and Development, 26(1), (1982),30-36.
Singer, Peter , “The New Low-K Candidate: It's a Gas”,Semiconductor International, 22(3), (Mar. 1999),38.
Vardaman, E. J., “Future Packaging Trends:CSPvsFlip Chip”,11th European Microelectrics Conference, Venice, (1997),295-299.
Ahn Kie Y.
Bhattacharyya Arup
Farrar Paul A.
Forbes Leonard
Geusic Joseph E.
Micro)n Technology, Inc.
Schwegman Lundberg & Woessner, P.A.
Zarneke David A.
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