Integrated circuit component and mounting method thereof

Details Integrated circuit component and mounting method thereof Integrated circuit component and mounting method thereof

2008-05-20

2008-05-20

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S737000, C257S772000, C257S779000, C257SE23021, C257SE23023, C257SE23069, C438S613000, C438S614000, C438S615000, C438S616000, C438S617000

Reexamination Certificate

active

11321811

ABSTRACT:
Disclosed are an integrated circuit component capable of simply mounting at low cost a chip part which adjusts impedance of wiring patterns as well as capable of effectively reducing switching noise from an integrated circuit, and a method for mounting the chip part. The integrated circuit component of the present invention has a constitution that a bypass capacitor is mounted on a wiring board side of a gap between the wiring board and an LSI chip. Therefore, as compared with a case where the capacitor is mounted on the LSI chip side, a transmission path through the capacitor can be extremely shortened. As a result, inductance components of the feeder line can be reduced, so that a response delay of power transmitted through the feeder line can be sufficiently suppressed.

REFERENCES:
patent: 6228682 (2001-05-01), Farooq et al.
patent: 6285079 (2001-09-01), Kunikiyo
patent: 6713871 (2004-03-01), Searls et al.
patent: 63-056922 (1988-03-01), None
patent: 11-121899 (1999-04-01), None
patent: 2001-102512 (2001-04-01), None
patent: 2003-124430 (2003-04-01), None
International Search Report dated Dec. 9, 2003.

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