Integrated circuit, circuit system, and method of manufacturing

Details Integrated circuit, circuit system, and method of manufacturing Integrated circuit, circuit system, and method of manufacturing

2007-09-14

2011-12-06

Ngo, Ngan (Department: 2893)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

C257S741000, C257S773000, C257SE23015, C257SE23010, C257SE23078, C257SE23194, C257S181000, C257S178000, C257S688000, C257S747000

Reexamination Certificate

active

08072084

ABSTRACT:
An integrated circuit, a circuit system and method of manufacturing such is disclosed. One embodiment provides a circuit chip including a first contact field on a chip surface; and an insulating layer on the chip surface. The insulating layer includes a flexible material. A contact pillar is coupled to the first contact field and extends from the chip surface through the insulating layer. The contact pillar includes a conductive material.

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