Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate
2007-07-09
2009-02-10
Zarneke, David A (Department: 2891)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
C257SE21513
Reexamination Certificate
active
07488623
ABSTRACT:
An integrated circuit chip packaging assembly having a first and second package side. An integrated circuit chip has a substrate side and an active circuit side. The chip includes integrated circuit devices formed on the active circuit side. The active circuit side of the chip is on the first package side. The die pad has at least one runner member extending therefrom, which may be bent toward the first package side. The active circuit side of the chip is attached to the die pad. The die pad is on the first package side relative to the chip. The package mold compound is formed over the die pad, at least part of the chip, and at least part of the runner member(s). At least part of the substrate side of the chip and/or at least part of the runner member(s) may not be covered by the package mold compound.
REFERENCES:
patent: 6075284 (2000-06-01), Choi et al.
patent: 6646329 (2003-11-01), Estacio et al.
Coyle Anthony L
Kummerl Steven A
Lange Bernhard
Brady III Wade J.
Telecky , Jr. Frederick J.
Texas Instruments Incorporated
Tung Yingsheng
Zarneke David A
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