Stock material or miscellaneous articles – Web or sheet containing structurally defined element or... – Composite having a component wherein a constituent is liquid...
Patent
1996-11-08
1999-05-04
Krynski, William
Stock material or miscellaneous articles
Web or sheet containing structurally defined element or...
Composite having a component wherein a constituent is liquid...
4283084, 4283171, 428325, 428344, 428421, 428901, 174255, 174258, 174259, 174729, 257702, 257703, 257705, B32B 900, B32B 326
Patent
active
059003120
ABSTRACT:
A package for mounting an integrated circuit chip includes a body having at least a first region and a second region. The first region has a first coefficient of thermal expansion (CTE), and the second region has a second, different CTE. The first region approximately matches the CTE of the integrated circuit chip mounted on the package, and the second region approximates the CTE of the printed wiring board to which the package is mounted.
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Genco, Jr. Victor M.
Krynski William
Lam Cathy F.
W. L. Gore & Associates, Inc.
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