Integrated circuit chip formed from processing two opposing surf

Details Integrated circuit chip formed from processing two opposing surf Integrated circuit chip formed from processing two opposing surf

1996-01-16

1997-12-30

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Chip mounted on chip

257690, 257723, 257774, 257778, H01L 2348, H01L 2352

Patent

active

057034052

ABSTRACT:
An integrated circuit chip (100) includes an integrated circuit die (105) having first and second opposing surfaces (110, 115). A first integrated circuit (205) is formed on the first surface (110), and has a first plurality of terminals (200) coupled thereto for connection to first circuitry external to the integrated circuit chip (100), wherein the first plurality of terminals (200) is formed on the first surface (110). A second integrated circuit (300) is formed on the second surface (115), is electrically isolated from the first integrated circuit (205), and has a second plurality of terminals (305) coupled thereto for connection to second circuitry external to the integrated circuit chip (100). The second plurality of terminals (305) is formed on the first surface (110) and is coupled to the second integrated circuit (300) via plated holes formed through the integrated circuit die (105). The second plurality of terminals (300) is electrically isolated from the first plurality of terminals (200) and the first integrated circuit (205).

REFERENCES:
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patent: 4700473 (1987-10-01), Freyman et al.
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patent: 4792532 (1988-12-01), Ohtani et al.
patent: 4819041 (1989-04-01), Redmond
patent: 4939568 (1990-07-01), Kato et el.
Solder Bonding of Silicon Chips with Through Holes, Kuhn et al., IBM TDB vol. 18, No. 10, 3176, p. 3478.
"Basic Integrated Circuitry", pp. 1-30, by Hamilton and Howard, published by McGraw-Hill., Inc., 1975.

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