Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Patent
1996-01-16
1997-12-30
Thomas, Tom
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Chip mounted on chip
257690, 257723, 257774, 257778, H01L 2348, H01L 2352
Patent
active
057034052
ABSTRACT:
An integrated circuit chip (100) includes an integrated circuit die (105) having first and second opposing surfaces (110, 115). A first integrated circuit (205) is formed on the first surface (110), and has a first plurality of terminals (200) coupled thereto for connection to first circuitry external to the integrated circuit chip (100), wherein the first plurality of terminals (200) is formed on the first surface (110). A second integrated circuit (300) is formed on the second surface (115), is electrically isolated from the first integrated circuit (205), and has a second plurality of terminals (305) coupled thereto for connection to second circuitry external to the integrated circuit chip (100). The second plurality of terminals (305) is formed on the first surface (110) and is coupled to the second integrated circuit (300) via plated holes formed through the integrated circuit die (105). The second plurality of terminals (300) is electrically isolated from the first plurality of terminals (200) and the first integrated circuit (205).
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"Basic Integrated Circuitry", pp. 1-30, by Hamilton and Howard, published by McGraw-Hill., Inc., 1975.
Gardner Kelly A.
Macnak Philip P.
Motorola Inc.
Ostrowski David
Thomas Tom
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