Integrated circuit carrier having lead-socket array with various

Details Integrated circuit carrier having lead-socket array with various Integrated circuit carrier having lead-socket array with various

1996-07-01

1997-09-16

Jackson, Jerome

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257694, 257727, 257785, 257697, 361772, H01L 2348

Patent

active

056684070

ABSTRACT:
An IC carrier for electric testing of an IC package enables an IC package to be loaded on or unloaded from it smoothly without bending any of closely arranged fine leads, and prevents the leads from being deformed by falling impact when it is dropped. The IC carrier for an IC package, having an array of leads, comprises an array of sockets for mating with the array of leads, wherein selected one of the sockets differs in clearance between a width of each of the sockets and a width of each of the leads to be mated from the other ones in a cross section of an array. For instance, an array of sockets having holes to mate with leads having a single diameter of an IC package are arranged so that inner diameters of the holes in an outer part of the array is larger than those in a central part of the array. The technique is applicable to both a flat IC package (QFP or SOP) and a pin grid array IC package (PGA).

REFERENCES:
patent: 4725692 (1988-02-01), Ishii et al.
patent: 4875138 (1989-10-01), Cusack

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