Integrated circuit assembly module that supports capacitive...

Details Integrated circuit assembly module that supports capacitive... Integrated circuit assembly module that supports capacitive...

2005-03-22

2005-03-22

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Chip mounted on chip

C257S691000, C257S723000, C361S735000

Reexamination Certificate

active

06870271

ABSTRACT:
One embodiment of the present invention provides an integrated circuit assembly module, including a first semiconductor die and a second semiconductor die, each semiconductor die with an active face upon which active circuitry and signal pads reside and a back face opposite the active face. The first and second semiconductor dies are positioned face-to-face within the assembly module so that signal pads on the first semiconductor die overlap with signal pads on the second semiconductor die, thereby facilitating capacitive communication between the first and second semiconductor dies. Additionally, the first and second semiconductor dies are pressed together between a first substrate and a second substrate so that a front side of the first substrate is in contact with the back face of the first semiconductor die and a front side of the second substrate is in contact with the back face of the second semiconductor die.

REFERENCES:
patent: 5491612 (1996-02-01), Nicewarner, Jr.
patent: 5703400 (1997-12-01), Wojnarowski et al.
patent: 6500696 (2002-12-01), Sutherland
patent: 6507115 (2003-01-01), Hofstee et al.
patent: 6552423 (2003-04-01), Song et al.
patent: 6555917 (2003-04-01), Heo
patent: 6555918 (2003-04-01), Masuda et al.
patent: 6586836 (2003-07-01), Ma et al.

Affiliated with

Also associated with

Rating

Integrated circuit assembly module that supports capacitive... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Integrated circuit assembly module that supports capacitive..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated circuit assembly module that supports capacitive... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3402339