Integrated circuit arrangement having at least one power compone

Details Integrated circuit arrangement having at least one power compone Integrated circuit arrangement having at least one power compone

1994-09-29

1995-12-05

Saadat, Mahshid

Active solid-state devices (e.g., transistors, solid-state diode

Field effect device

Having insulated electrode

257287, 257329, 257383, 257500, 257502, H01L 2700, H01L 2978, H01L 2354

Patent

active

054731810

ABSTRACT:
In an integrated circuit arrangement having at least one power component and low-voltage components, the at least one power component is realized in a semiconductor substrate. At least one contact of the power component is arranged on a principal surface of the substrate. The contact is covered with an insulation layer at a surface of which at least one thin-film component, particularly a thin-film transistor, is provided above the contact.

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