Integrated circuit arrangement having a plurality of...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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Details

C257S306000, C257S309000, C257SE27048

Reexamination Certificate

active

07667256

ABSTRACT:
An integrated circuit arrangement is disclosed. In one embodiment, the integrated circuit arrangement includes at least three conductive structure levels in which in each case elongated interconnects are arranged.

REFERENCES:
patent: 5943598 (1999-08-01), Lin
patent: 6297524 (2001-10-01), Vathulya et al.
patent: 6570210 (2003-05-01), Sowlati et al.
patent: 6690570 (2004-02-01), Hajimiri et al.
patent: 6743671 (2004-06-01), Hu et al.
patent: 6770512 (2004-08-01), Mahanpour et al.
patent: 6808975 (2004-10-01), Song et al.
patent: 7385241 (2008-06-01), Choi
patent: 2008/0070339 (2008-03-01), Power et al.
patent: 102 49 192 (2004-05-01), None
patent: 0 905 778 (1999-03-01), None
Patent Search Report of Application No. 095134498 (1 sheet).
German Office Action dated Nov. 27, 2008, with English translation (4 pages).
Office Action dated Feb. 3, 2009, for U.S. Appl. No. 11/525,113.

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