Integrated circuit and methods of manufacturing the same

Details Integrated circuit and methods of manufacturing the same Integrated circuit and methods of manufacturing the same

2007-09-28

2010-12-14

Sarkar, Asok K (Department: 2891)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S672000, C257SE21678

Reexamination Certificate

active

07851356

ABSTRACT:
A method of manufacturing an integrated circuit includes forming landing pads in an array region of a substrate, individual ones of the landing pads being electrically coupled to individual ones of portions of devices formed in the substrate in the array region. The method also includes forming wiring lines within a peripheral region of the substrate. Forming the landing pads and forming the wiring lines includes a common lithographic process being effective in both the array and peripheral regions. The wiring lines and the landing pads of the integrated circuit are self-aligned.

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Quirk and Serda, “Semicondctor Manufacturing Technology,” Prentice-Hall, 2001, pp. 462-463.

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