Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent
1992-03-18
1993-07-13
James, Andrew J.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
257688, 257705, 257706, 257719, 257796, 361386, H01L 3902, H01L 2302, H01L 2348, H02B 100
Patent
active
052276635
ABSTRACT:
A metallic or ceramic dam structure surrounding a semiconductor die in a semiconductor device assembly is disclosed. The dam structure forms a cavity containing a potting compound encapsulating the die. The dam structure may also be provided with a flat lid portion, enclosing the cavity and forming a flat, exterior, heat-dissipating surface for the semiconductor device assembly. Further, an additional add-on structure, having heat dissipating fins, may be joined to the dam structure, exterior the semiconductor device assembly, to provide additional heat dissipation. The add-on structure is particularly well-suited to applications where air cooling is available.
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Murphy Adrian
Newman Keith
Patil Sadanand
James Andrew J.
Jr. Carl Whitehead
Linden Gerald E.
LSI Logic Corporation
Rostoker Michael D.
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