Integral cold plate/chasses housing applicable to...

Details Integral cold plate/chasses housing applicable to... Integral cold plate/chasses housing applicable to...

2007-11-13

2007-11-13

Datskovskiy, Michael (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S699000, C361S715000, C361S717000, C165S080400, C174S016300, C174S050000, C174S050520, C174S520000, C312S223100

Reexamination Certificate

active

11370966

ABSTRACT:
An integral cold plate/chassis (ICPC) housing may be formed from two blocks of material, having a cold plate sandwiched therebetween, brazed together. The blocks may then be machined to fit power electronics therein, thereby providing a cold plate as an integral part of the power electronic's housing. Unlike conventional heat exchangers that may be used to dissipate heat from power-dissipating components that are housed typically in sheet metal housings, the ICPC described herein provides a cold plate integral to the housing of power electronics, thereby allowing the rapid and efficient removal of heat from the components into the cold plate carrier fluid and out of the system.

REFERENCES:
patent: 4120021 (1978-10-01), Roush
patent: 4468717 (1984-08-01), Mathias et al.
patent: 4714107 (1987-12-01), Adsett
patent: 4998584 (1991-03-01), Foglesonger et al.
patent: 5159529 (1992-10-01), Lovgren et al.
patent: 5620646 (1997-04-01), Sparer et al.
patent: 6292365 (2001-09-01), Ashiwake et al.
patent: WO 02/35898 (2002-05-01), None
patent: WO 2006/105835 (2006-10-01), None
The Article “Hermetically sealed, field removable module having integral pump and coolant heat exchanger for connection immersion cooling of electronic circuit modules”, IBM Technical Disclosure Bulletine, Sep. 1992, vol. 35, Issue 4B, pp. 443-444.

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