Insulation sheet, multi-layer wiring substrate and...

Details Insulation sheet, multi-layer wiring substrate and... Insulation sheet, multi-layer wiring substrate and...

2005-02-15

2005-02-15

Reichard, Dean A. (Department: 2831)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S258000, C174S264000, C428S321300

Reexamination Certificate

active

06855892

ABSTRACT:
An insulation sheet for use in producing a wiring substrate comprises, as via bole conductors, conductive paste filled in via holes formed through the insulation sheet, and a curing-starting temperature of the conductive paste is lower than a melting-starting temperature of the insulation sheet. A wiring substrate is produced by laminating such insulation sheets, that have conductive paste in via holes, and subjecting this laminate to thermo-compression bonding, wherein deformation of via holes and dislocation of the via holes, because of a molten insulation sheet, does not occur.

REFERENCES:
patent: 6038133 (2000-03-01), Nakatani et al.
patent: 6138350 (2000-10-01), Bhatt et al.
patent: 6239983 (2001-05-01), Shingai et al.
patent: 6451710 (2002-09-01), Oka et al.
patent: 6518514 (2003-02-01), Suzuki et al.
patent: 6528733 (2003-03-01), Takenaka et al.
patent: 6538210 (2003-03-01), Sugaya et al.
patent: 6625880 (2003-09-01), Nabemoto et al.
patent: 11-220262 (1999-08-01), None
patent: 2001-155544 (2001-06-01), None

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