Insulating substrate, manufacturing method thereof, and...

Details Insulating substrate, manufacturing method thereof, and... Insulating substrate, manufacturing method thereof, and...

2007-09-04

2007-09-04

Whitehead, Jr., Carl (Department: 2813)

Metal working

Method of mechanical manufacture

Electrical device making

C361S748000, C428S901000, C174S258000

Reexamination Certificate

active

10351312

ABSTRACT:
An insulating substrate (1) has insulative ceramic layers (2, 3) laid one upon another, an intermediate layer (4) made of a material that is different from a material of the ceramic layers and arranged between adjacent ones of the ceramic layers to join the adjacent ceramic layers to each other, a first conductive layer (5) joined to the top surface of a top one of the ceramic layers, and a second conductive layer (6) joined to the bottom surface of a bottom one of the ceramic layers. Even if any one of the ceramic layers has strength lower than design strength and causes a breakage due to, for example, thermal stress, the remaining ceramic layers are sound to secure a specified breakdown voltage for the insulating substrate.

REFERENCES:
patent: 4299873 (1981-11-01), Ogihara et al.
patent: 4868711 (1989-09-01), Hirama et al.
patent: 5120377 (1992-06-01), Morohashi et al.
patent: 5276955 (1994-01-01), Noddin et al.
patent: 5-167006 (1993-07-01), None
patent: 9-121004 (1997-05-01), None
patent: 10-93244 (1998-04-01), None
Handbook of Physical Quantities, edited by I. Grigoriev and E. Meilikhov, CRC Press, 1997, p. 667.

Affiliated with

Also associated with

Rating

Insulating substrate, manufacturing method thereof, and... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Insulating substrate, manufacturing method thereof, and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Insulating substrate, manufacturing method thereof, and... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3753272