Insulating substrate for IC packages having integral ESD...

Details Insulating substrate for IC packages having integral ESD... Insulating substrate for IC packages having integral ESD...

2007-04-17

2007-04-17

Pert, Evan (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Field effect device

Having insulated electrode

C257S356000, C257S357000, C257S360000, C257S361000, C257S362000, C257S678000, C257S774000

Reexamination Certificate

active

11033354

ABSTRACT:
An IC package substrate having integral ESD protection features and elements and a method for construction of the same are disclosed

REFERENCES:
patent: 6476472 (2002-11-01), Davison et al.
patent: 2003/0089979 (2003-05-01), Malinowski et al.

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