Insulated lead frame for integrated circuits and method of manuf

Details Insulated lead frame for integrated circuits and method of manuf Insulated lead frame for integrated circuits and method of manuf

1993-07-15

1994-10-25

Prenty, Mark V.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257691, 257696, 257784, 257787, H01L 2348, H01L 2328

Patent

active

053592247

ABSTRACT:
An insulated lead frame is disclosed. The preferred embodiment contains a lead over chip lead frame having an aluminum oxide insulator on portions of the power supply busses where no electrical connections will be made. The aluminum oxide may be easily deposited by an arc deposition process such as by plasma deposition. A mask prohibits the aluminum oxide from coating the places on the power supply busses where electrical connection, such as by wire bond, will be made. Wire bonds crossing over the power supply busses as they connect bond pads to the lead fingers of the lead frame are therefore less likely to short to the insulated power supply busses. A semiconductor packaged device having an aluminum oxide coating to the underside of the chip support pad is also disclosed. The aluminum oxide coating promotes adhesion between the chip support pad and the encapsulant, that is typically plastic, thereby preventing the chance of delamination and package cracking.

REFERENCES:
patent: 3783347 (1974-01-01), Vladik
patent: 4707724 (1987-11-01), Suzuki et al.
patent: 4862245 (1989-08-01), Pashby et al.

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