Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds
Reexamination Certificate
2005-05-17
2005-05-17
Flynn, Nathan J. (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Configuration or pattern of bonds
C257S723000, C257S777000, C257S782000, C257S784000
Reexamination Certificate
active
06894398
ABSTRACT:
An insulated bond wire to connect integrated circuits to each other or to substrates. Insulated bond wires may allow bond wires connecting integrated circuits and substrates to cross without shorting. Because bond wires may be crossed, integrated circuit assemblies with crossing bond wires may not need to be redesigned to avoid the wire crossings. In addition, insulated bond wires may also allow for closer spacing between bond wires due to reduced electronic interference between the wires. Closer spacing may allow for more input and output ports on an integrated circuit and thus increase its functionality.
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Andújar Leonardo
Blakely , Sokoloff, Taylor & Zafman LLP
Flynn Nathan J.
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